Semiconductor Device, Tool, and Method of Manufacturing
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMeng-Hsien Li, Hsin-Hsien Lu
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Abstract
A semiconductor device is manufactured using a cleaning process. The cleaning process utilizes a semiconductor manufacturing tool that has a wet cleaning section and a plasma cleaning section. The semiconductor device is placed within a wet cleaning chamber within the wet cleaning section, where a wet cleaning process is performed. Once completed, and without breaking atmosphere, the semiconductor device is removed from the wet cleaning section and placed within a plasma cleaning chamber within the plasma cleaning section. A plasma clean is then performed.
Claims20
A semiconductor device manufacturing tool comprising:
- a first wet etch cleaning station;
- a first plasma treatment station;
- a transfer station operationally located between the first wet etch cleaning station and the first plasma treatment station;
- and
- an exterior housing surrounding all of the first wet etch cleaning station, the first plasma treatment station, and the transfer station.
A semiconductor device manufacturing tool comprising:
- a wet etch section comprising a plurality of wet etching chambers;
- a first transfer station located to operate cooperatively with at least one of the wet etching chambers;
- and
- a plasma treatment section comprising a plurality of plasma treatment chambers, wherein at least one of the plurality of plasma treatment chambers is located to operate cooperatively with the first transfer station, wherein the wet etch section, the first transfer station, and the plasma treatment section are part of a single machine.
A semiconductor device manufacturing tool comprising:
- a wet etching section comprising a wet etching station;
- a plasma treatment section comprising a plasma treatment station;
- a transferred station between the wet etching section and the plasma treatment section;
- and
- a housing around the wet etch section, the plasma treatment section, and the transfer station, wherein the transfer station is configured to transfer a wafer from the wet etching station to the plasma treatment station without breaking to exterior atmosphere.
Dependencies are inferred from the claim text.