Substrate processing apparatus, substrate processing method, and computer storage medium
AssigneeTokyo Electron Limited
InventorsToshimitsu SAKAI, Sakae YAMASHITA, Keiichi NAGAKUBO, Yoshiaki SASAKI
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Abstract
A substrate processing apparatus includes a processing chamber in which a substrate is processed in a depressurized atmosphere and a transfer chamber connected to the processing chamber through a gate. A first gas supply unit is configured to supply an inert gas into the transfer chamber. A second gas supply unit is configured to supply an inert gas to the gate. A gas exhaust unit is configured to exhaust an atmosphere in the transfer chamber.
Claims11
A substrate processing apparatus comprising:
- a processing chamber in which a substrate is processed in a depressurized atmosphere;
- a transfer chamber connected to the processing chamber through a gate;
- a first gas supply unit configured to supply an inert gas into the transfer chamber;
- a second gas supply unit configured to supply an inert gas to the gate;
- and
- a gas exhaust unit configured to exhaust an atmosphere in the transfer chamber.
A substrate processing method using a substrate processing apparatus including a processing chamber in which a substrate is processed in a depressurized atmosphere and a transfer chamber connected to the processing chamber through a gate, the method comprising:
- supplying an inert gas from a first gas supply unit into the transfer chamber during the processing of the substrate in the processing chamber and transfer of the substrate between the processing chamber and the transfer chamber, and
- supplying an inert gas from a second gas supply unit to the gate when the gate is opened to transfer the substrate between the processing chamber and the transfer chamber.
Dependencies are inferred from the claim text.