Method for manufacturing module component

A method for manufacturing a module component comprising:

• arranging a plurality of surface mounting components on a component mounting surface of a transfer substrate, each of the surface mounting components have a mounting terminal facing the component mounting surface of the transfer substrate;
• forming a resin layer on the component mounting surface of the transfer substrate and burying the plurality of surface mounting components in the resin layer;
• peeling the resin layer from the transfer substrate, with the surface mounting components buried in the resin layer, to expose a surface of the resin layer;
• forming an intermediate auxiliary layer on the exposed surface of the resin layer, the intermediate auxiliary layer including openings for exposing the mounting terminals and having metal materials arranged in the openings;
• and
• joining a wiring sheet including a thermoplastic resin sheet with a plurality of unmetallized via patterns and an electrode pattern connected to the via patterns to the intermediate auxiliary layer such that each of the via patterns aligns with a respective one of the openings in the intermediate auxiliary layer and performing heat treatment to fuse the thermoplastic resin sheet to the intermediate auxiliary layer and to metallize the via patterns so as to electrically connect the mounting terminals and the electrode pattern.