Pulsed Sputtering Apparatus and Pulsed Sputtering Method

A method for pulse sputtering by using a pulse sputtering device comprising a vacuum vessel, a sputtering source operatively connected to a sputtering source pulse power supply that performs pulse discharge and generates plasma, a gas injection valve operatively connected to a gas injection valve pulse power supply that injects and supplies an inert gas to the sputtering source, and a controller that is configured to control the sputtering source and the gas injection valve, wherein the method comprising steps of:

• controlling the gas injection valve by the controller such that the gas injection valve injects the inert gas intermittently;
• controlling the sputtering source and the gas injection valve by the controller such that a part of a period in which the pulse discharge occurs in the sputtering source overlaps with a part of a period, in which the gas injection valve injects and supplies the inert gas or such that a period in which the pulse discharge occurs in the sputtering source is included in a period in which the gas injection valve injects and supplies the inert gas;
• wherein a vacuum condition in the vacuum vessel is between 10−2 to 10−4 Pa.