Back to results
US 2019/0096604 A1Published application
Keypad module
AssigneesLite-On Electronics (Guangzhou) Limited, Lite-On Technology Corporation
InventorMing-Fu Yen
Life of this patent
Estimating the term…
Abstract
The invention provides a keypad module, including a bottom plate, a circuit film, an elastic element, a scissor structure, a keycap and a buffering material layer. The circuit film is disposed on the bottom plate and includes a switch. The elastic element is disposed on the switch. The scissor structure is fixed on the bottom plate. The keycap is disposed on the scissor structure. The buffering material layer is disposed on the inner surface of the keycap.
Claims10
A keypad module, comprising:
- a bottom plate;
- a circuit film, disposed on the bottom plate and comprising a switch;
- an elastic element, disposed on the switch;
- a scissor structure, fixed on the bottom plate;
- a keycap, disposed on the scissor structure;
- and
- a buffering material layer, disposed on an inner surface of the keycap,
- wherein an area of the buffering material layer is smaller than an area of the inner surface of the key cap.
5 more elements
Dependencies are inferred from the claim text.