Electronic component, diaphragm, and electronic device
AssigneeMurata Manufacturing Co., Ltd.
InventorsShingo ITO, Naoki GOUCHI, Kosuke TAKEUCHI
Life of this patent
Estimating the term…
Abstract
An electronic component includes an insulating base material including insulating base material layers, a first main surface that is a mounting surface, a coil, mounting electrodes provided on the first main surface, and a projection. The coil includes coil conductors provided on the insulating base material layers and a winding axis in a laminating direction of the insulating base material layers. The projection is provided in an electrode non-forming portion of the first main surface, the electrode non-forming portion including no mounting electrodes therein, and provided along the coil conductors in planar view of the first main surface.
Claims20
An electronic component comprising:
- an insulating base material including a first main surface on a mounting surface side, the insulating base material including a plurality of insulating base material layers that are laminated in a lamination direction;
- a coil including a coil conductor provided on at least one of the plurality of insulating base material layers and including a winding axis extending in the lamination direction;
- a mounting electrode provided on the first main surface and connected to the coil;
- a projection provided on at least an electrode non-forming portion of the first main surface, the electrode non-forming portion including no mounting electrode;
- and
- a recess or a through-hole provided in the electrode non-forming portion and disposed at a position including a coil opening of the coil when viewed from the lamination direction;
- wherein
- the projection is provided along the coil conductor in a planar view of the first main surface;
- the coil conductor is disposed across different positions in the lamination direction;
- and
- a portion of the coil conductor, which is positioned on an innermost peripheral side when viewed from a winding axis direction, is farther away from the first main surface in the lamination direction as compared to a portion located closest to a side of the first main surface.
A diaphragm comprising:
- a flexible support film including a routing conductor;
- and
- an electronic component fixed to the support film by a conductive bonding material and an insulating bonding material;
- wherein
- the electronic component includes:
- an insulating base material including a first main surface on a mounting surface side, the insulating base material including a plurality of insulating base material layers that are laminated in a lamination direction;
- a coil including a coil conductor provided on at least one of the plurality of insulating base material layers and including a winding axis extending in the lamination direction;
- a mounting electrode provided on the first main surface and connected to the coil;
- a projection provided on at least an electrode non-forming portion of the first main surface, the electrode non-forming portion including no mounting electrode;
- and
- a recess or a through-hole provided in the electrode non-forming portion and disposed at a position including a coil opening of the coil when viewed from the lamination;
- the projection is provided along the coil conductor in a planar view of the first main surface;
- the coil conductor is disposed across different positions in the lamination direction;
- a portion of the coil conductor, which is positioned on an innermost peripheral side when viewed from a winding axis direction, is farther away from the first main surface in the lamination direction as compared to a portion located closest to a side of the first main surface;
- the mounting electrode is connected to the routing conductor of the support film with the conductive bonding material interposed therebetween;
- and
- in the first main surface, a bonding portion bonded to the support film with the insulating bonding material interposed therebetween includes the projection.
An electronic device comprising:
- a mounting substrate;
- and
- an electronic component mounted on the mounting substrate by a conductive bonding material and an insulating bonding material;
- wherein
- the electronic component includes:
- an insulating base material including a first main surface on a mounting surface side, the insulating base material including a plurality of insulating base material layers that are laminated in a lamination direction;
- a coil including a coil conductor provided on at least one of the plurality of insulating base material layers and having a winding axis extending in the lamination direction;
- a mounting electrode provided on the first main surface and connected to the coil;
- a projection provided on at least an electrode non-forming portion of the first main surface, the electrode non-forming portion including no mounting electrode;
- and
- a recess or a through-hole provided in the electrode non-forming portion and disposed at a position including a coil opening of the coil when viewed from the lamination direction;
- the projection is provided along the coil conductor in a planar view of the first main surface;
- the coil conductor is disposed across different positions in the lamination direction;
- a portion of the coil conductor, which is positioned on an innermost peripheral side when viewed from a winding axis direction, is farther away from the first main surface in the lamination direction as compared to a portion located closest to a side of the first main surface;
- the mounting electrode is connected to the mounting substrate with the conductive bonding material interposed therebetween;
- and
- in the first main surface, a bonding portion bonded to the mounting substrate with the insulating bonding material interposed therebetween includes the projection.
Dependencies are inferred from the claim text.