Stacked memory device, a system including the same and an associated method

A memory system, comprising:

• a base substrate:
• at least one logic semiconductor die stacked on the base substrate;
• a plurality of memory semiconductor dies stacked on the base substrate or on the logic semiconductor die;
• and
• a plurality of calculation units formed in one or more calculation semiconductor dies among the plurality of memory semiconductor dies, wherein each of the calculation units is configured to perform calculations based on broadcast data and internal data and to generate calculation result data, wherein the broadcast data is commonly provided to the calculation semiconductor dies, and the internal data is respectively read from memory integrated circuits of the calculation semiconductor dies.

A method of operating a stacked memory device, the stacked memory device including a calculation unit in each of a plurality of calculation semiconductor dies stacked in a vertical direction, the method comprising:

• providing broadcast data, in common, to each of the calculation units through through-silicon vias electrically connecting the calculation semiconductor dies;
• providing internal data respectively read from memory integrated circuits of the calculation semiconductor dies to each of calculation units;
• and
• performing a plurality of calculations based on the broadcast data and the internal data simultaneously using the calculation units.