Electronic apparatus and fingerprint module thereof
AssigneeGuangdong Oppo Mobile Telecommunications Corp., Ltd.
InventorsWeibin YU, Maozhao HUANG, Mao YANG
Life of this patent
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Abstract
A fingerprint module and an electronic apparatus are described. The fingerprint module may include: an encapsulation layer and a decoration component. The encapsulation layer may be configured to encapsulate a fingerprint identifying assembly and include a rear wall having a first mating portion. The decoration component may define an embedded groove and include a second mating portion in the embedded groove. The encapsulation layer may be embedded in the embedded groove, and the first mating portion may be embedded to the second mating portion.
Claims20
A fingerprint module, comprising:
- an encapsulation layer, configured to encapsulate a fingerprint identifying assembly and comprising a rear wall having a first mating portion;
- and
- a decoration component, defining an embedded groove and comprising a second mating portion in the embedded groove;
- wherein the encapsulation layer is embedded in the embedded groove, and the first mating portion is embedded to the second mating portion.
A fingerprint module, comprising:
- an encapsulation layer configured to encapsulate a fingerprint identifying assembly and comprising a end surface, wherein an edge region of the end surface is recessed to form a first step portion;
- a decoration component, comprising a sidewall and a bottom wall, wherein the sidewall and the bottom wall defines an embedded cavity, an inner surface of the sidewall close to the embedded cavity forms a second step portion;
- and
- a circuit board assembly, at least part of the circuit board assembly being received in the embedded cavity;
- wherein the encapsulation layer is received in the embedded cavity and the first step portion matches with the second step portion, such that the circuit board assembly is electrically connected to the fingerprint identifying assembly.
An electronic apparatus, comprising:
- a shell assembly;
- a display assembly, connected to the shell assembly;
- and
- a fingerprint module, embedded in the display assembly and comprising:
- a finger identifying assembly;
- an encapsulation layer configured to encapsulated the finger identifying assembly, comprising a end surface, wherein an edge region of the end surface is recessed to form a first step portion;
- a decoration component, comprising a sidewall and a bottom wall, wherein the sidewall and the bottom wall defines an embedded cavity, a side of the sidewall near the embedded cavity forms a second step portion;
- and
- a circuit board assembly, at least part of the circuit board assembly being received in the embedded cavity;
- wherein the encapsulation layer is received in the embedded cavity and the first step portion matches with the second step portion, such that the circuit board assembly is electrically connected to the fingerprint identifying assembly.
Dependencies are inferred from the claim text.