Optical fingerprint sensing unit and manufacturing method thereof
AssigneePrimax Electronics Ltd.
InventorKuan-Pao Ting
Life of this patent
Estimating the term…
Abstract
An optical fingerprint sensing unit includes a substrate, a circuit pattern, an optical fingerprint sensing chip, an encapsulation layer and a fiber-optic layer. The circuit pattern is formed on a surface of the substrate. The optical fingerprint sensing chip is fixed on the substrate. The optical fingerprint sensing chip is electrically connected with the circuit pattern through a metal wire. The optical fingerprint sensing chip, the circuit pattern and the metal wire are covered by the encapsulation layer. The fiber-optic layer is disposed on the encapsulation layer. After a UV-curable optically clear adhesive is subjected to a light-curing reaction, the encapsulation layer is formed.
Claims40
A method for manufacturing an optical fingerprint sensing unit, the method comprising steps of:
- (a) providing a fixture, wherein the fixture comprises a positioning post, and the positioning post comprises a first sheathing end and a second sheathing end;
- (b) providing a chip board, which comprises a substrate, plural optical fingerprint sensing chips, a circuit pattern and a first positioning hole, wherein the first positioning hole is sheathed around the first sheathing end of the positioning post, so that the chip board is fixed on the fixture;
- (c) coating a first optically clear adhesive on periphery regions of the plural optical fingerprint sensing chips and the circuit pattern, so that an anti-overflow structure is formed;
- (d) filling a second optically clear adhesive in a region that is enclosed by the anti-overflow structure;
- (e) imprinting and light-curing the first optically clear adhesive and the second optically clear adhesive, so that an encapsulation layer is formed;
- (f) coating a third optically clear adhesive on a surface of the encapsulation layer;
- (g) providing a fiber-optic plate, which comprises a second positioning hole, wherein after the second positioning hole is sheathed around the second sheathing end of the positioning post, the fiber-optic plate is fixed on the surface of the encapsulation layer that is coated with the third optically clear adhesive;
- (h) imprinting the fiber-optic plate and light-curing the third optically clear adhesive, so that the fiber-optic plate and the encapsulation layer are combined together;
- (i) baking the chip board;
- and
- (j) cutting the chip board to produce an optical fingerprint sensing unit.
An optical fingerprint sensing unit, comprising:
- a substrate;
- a circuit pattern formed on a surface of the substrate;
- an optical fingerprint sensing chip fixed on the substrate, wherein the optical fingerprint sensing chip is electrically connected with the circuit pattern through a metal wire;
- an encapsulation layer, wherein the optical fingerprint sensing chip, the circuit pattern and the metal wire are covered by the encapsulation layer;
- and
- a fiber-optic layer disposed on the encapsulation layer,
- wherein after a UV-curable optically clear adhesive is subjected to a light-curing reaction, the encapsulation layer is formed.
A touch screen with a fingerprint identification module, the touch screen comprising:
- an organic light emitting diode display device having a first surface and a second surface, wherein the first surface is touchable by a finger, and the second surface is opposed to the first surface;
- an optical fingerprint sensing unit fixed on the second surface, and comprising:
- a substrate;
- a circuit pattern formed on a surface of the substrate;
- an optical fingerprint sensing chip fixed on the substrate, wherein the optical fingerprint sensing chip is electrically connected with the circuit pattern through a metal wire;
- an encapsulation layer, wherein the optical fingerprint sensing chip, the circuit pattern and the metal wire are covered by the encapsulation layer;
- and
- a fiber-optic layer disposed on the encapsulation layer, and
- a flexible printed circuit board, wherein the substrate is fixed on the flexible printed circuit board, and the flexible printed circuit board is electrically connected with the substrate,
- wherein after a UV-curable optically clear adhesive is subjected to a light-curing reaction, the encapsulation layer is formed.
Dependencies are inferred from the claim text.