Fingerprint sensor module and method of manufacturing same
AssigneeCrucialtec Co., Ltd.
InventorsDong Nam SON, Ju Sung KIM
Life of this patent
Estimating the term…
Abstract
A fingerprint sensor module and a method of manufacturing same, the fingerprint sensor module including: a sensor package provided on a top portion of a base substrate, and having a sensor part electrically connected to the base substrate and sensing biometric information and the sensor package having an encapsulation part for covering the base substrate and the sensor part; and a cap coupled to the circumference of a side surface of the sensor package and forming an insertion space part.
Claims14
A fingerprint sensor module comprising:
- a sensor package comprising a sensor provided on an upper portion of a base substrate, the sensor being electrically connected to the base substrate and configured to sense biometric information, the sensor package further comprising an encapsulation part covering the base substrate and the sensor;
- and
- a cap which is coupled to a side circumference of the sensor package and forms an insertion space part.
A fingerprint sensor module comprising:
- a base substrate;
- a sensor provided on an upper portion of the base substrate, the sensor being electrically connected to the base substrate and configured to sense biometric information;
- and
- an encapsulation part covering the base substrate and the sensor,
- wherein the encapsulation part has a keycap shape and forms an insertion space part below the base substrate.
A method of manufacturing a fingerprint sensor module, the method comprising:
- manufacturing a sensor package;
- and
- coupling the sensor package and a cap.
Dependencies are inferred from the claim text.