Methods of direct cooling of packaged devices and structures formed thereby
AssigneeIntel Corporation
InventorsDevdatta P. Kulkarni, Richard J. Dischler, Je-Young Chang
Life of this patent
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Abstract
Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures formed herein may include a die disposed on a substrate; a cooling solution comprising a first surface and a second surface opposite the first surface, wherein the second surface is disposed on a backside of the die disposed on a package substrate. A lid comprising an outer surface is disposed on the first surface of the cooling solution, wherein the lid includes a plurality of fins disposed on an inner surface of the lid. A solder is disposed between the outer surface of the lid and the first surface of the cooling solution.
Claims16
1-25. (canceled)
A microelectronic package structure comprising:
- a die on a substrate;
- a cooling solution comprising a first surface and a second surface opposite the first surface, wherein the second surface is on a backside of the die;
- a lid comprising an outer surface and an inner surface, wherein a portion of the outer surface is on the first surface of the cooling solution, wherein the inner surface of the lid comprises a first portion and a second portion, opposite the first portion, wherein the first portion of the inner surface is adjacent the portion of the outer surface that is on the first surface of the cooling solution;
- a plurality of fins on the first portion of the inner surface of the lid, wherein the second portion of the inner surface is above the plurality of fins;
- and
- a solder material between the portion of the outer surface of the lid that is on the cooling solution and the first surface of the cooling solution.
Dependencies are inferred from the claim text.