Photosensitive resin composition, cured film, display device, and pattern forming method
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsTatsuro ISHIKAWA, Naozumi MATSUMOTO, Dai SHIOTA
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AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsTatsuro ISHIKAWA, Naozumi MATSUMOTO, Dai SHIOTA
Estimating the term…
A photosensitive resin composition which gives a cured film having high light shielding properties and enables stable curing by baking at low temperature, a cured film obtained by curing the composition, a display device provided with the cured film, and a pattern forming method using the composition. A light shielding film-forming process which does not impart thermal damage to a light-emitting element with respect to a substrate provided with a light-emitting element. In a photosensitive resin composition including a binder resin, a photopolymerizable compound, a photopolymerization initiator, a coloring agent, and a thermosetting compound, a carbon black and/or an inorganic black pigment, and an organic pigment are used in combination as the coloring agent, and a photosensitive resin composition in which T2/T1 is 0.80 or more is used.
A photosensitive resin composition used to form a pattern on a substrate provided with a light-emitting element, the photosensitive resin composition comprising:
A photosensitive resin composition comprising:
A pattern forming method, comprising:
Dependencies are inferred from the claim text.