Assembly processes for three-dimensional microstructures

A method of fabricating a three-dimensional microstructure device, the method comprising:

• micromachining a substrate to form a plurality of discrete electrodes having a plurality of sidewalls;
• depositing seed layers onto the sidewalls of the discrete electrodes;
• depositing a substantially uniform sacrificial layer onto exposed surfaces of a three-dimensional microstructure;
• depositing the three-dimensional microstructure adjacent to the sidewalls of the discrete electrodes creating a first plurality of gaps between the sacrificial layer and the seed layers;
• depositing a plurality of conductive layers onto the seed layers to fill the first gaps, wherein the depositing of the conductive layers within the first gap continues until the respective conductive layer makes contact with a corresponding region of the sacrificial layer;
• and
• dissolving the sacrificial layer to release the three-dimensional microstructure, wherein release of the sacrificial layer creates a second plurality of gaps between the three-dimensional microstructure and the conductive layers, each second gap has a width that is smaller than that of the corresponding first gap, and the second gaps of the second plurality of gaps are substantially uniform with each other.