Back to results
US 2019/0092974 A1Published application
Polishing composition, method for producing polishing composition, polishing method, and method for producing semiconductor substrate
AssigneeFujimi Incorporated
InventorTzu-Chun TSENG
Life of this patent
Estimating the term…
Abstract
A polishing composition according to the present invention includes: silica; an anionic water-soluble polymer; at least one compound selected from the group consisting of a phosphonate group-containing compound, a phosphate group-containing compound, and an amino group-containing compound; and a dispersing medium.
Claims12
A polishing composition comprising:
- silica;
- an anionic water-soluble polymer;
- at least one compound selected from the group consisting of a phosphonate group-containing compound, a phosphate group-containing compound, and an amino group-containing compound;
- and
- a dispersing medium.
2 more elements
Dependencies are inferred from the claim text.