Method for cutting adhesive film, adhesive film, and wound body

Abstract

There is provided a method for cutting an adhesive film and an adhesive film that are novel and improved and capable of fabricating an adhesive film with a low glass transition point, high quality, and a width of less than 1 mm. According to an aspect of the present invention in order to achieve the above object, there is provided a method for cutting an adhesive film, the method including cutting, under a temperature environment of −40 to 10° C., an adhesive film that satisfies a condition of the following formula (1) and whose tack value per unit length under room temperature is 3N/cm or more. y≤−0.27x+11.4  (1) In the formula (1), x is a glass transition point (° C.) of the adhesive film, and y is a tack value per unit length (N/cm) under room temperature of the adhesive film.

Dependencies are inferred from the claim text.