# US 2019/0084208 A1 · Continuous extrusion method for manufacturing a z-directed component for insertion into a mounting hole in a printed circuit board

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- Number: US 2019/0084208 A1
- Document ID: US20190084208A1
- Status: Published application
- Kind: A1
- Application number: 16/189,015
- Filed: 2018-11-13
- Published: 2019-03-21
- Earliest claimed: 2011-10-28
- Assignees: Lexmark International, Inc.
- Applicants: Lexmark International, Inc.
- Inventors: KEITH BRYAN HARDIN; ZACHARY CHARLES NATHAN KRATZER; QING ZHANG
- Web page: https://patentgrep.com/patent/US20190084208A1

## CPC

- B29C 48/0022: {combined with cutting}
- B28B 3/20: wherein the material is extruded {(extrusion moulding of plastics B29C48/00)}
- B28B 11/16: for extrusion {or for materials supplied in long webs}
- B29C 48/022: {characterised by the choice of material}
- B29C 48/131: {Curved articles}
- H01G 4/33: Thin- or thick-film capacitors {(thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)}
- H01G 4/35: Feed-through capacitors or anti-noise capacitors
- H05K 1/0231: {Capacitors or dielectric substances}
- H05K 1/184: associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
- H05K 3/30: Assembling printed circuits with electric components, e.g. with resistors
- H05K 3/306: with lead-in-hole components (H05K3/32 takes precedence)
- B29K 2995/0005: Conductive
- B29K 2995/0007: Insulating
- B29L 2031/3425: {Printed circuits}
- H05K 1/0221: {Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines}
- H05K 1/0251: {related to vias or transitions between vias and transmission lines}
- H05K 1/0298: {Multilayer circuits}
- H05K 3/4046: {using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire}
- H05K 2201/10015: Non-printed capacitor
- H05K 2201/10053: Switch
- H05K 2201/10984: Component carrying a connection agent, e.g. solder, adhesive
- Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T 29/49135: and shaping, e.g., cutting or bending, etc.
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- B28B: SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER (foundry moulding B22C; working stone or stone-like material B28D; shaping of substances in a plastic state, in general B29C; making layered products not composed wholly of these substances B32B)
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes simultaneously extruding a plurality of materials according to the structure of the Z-directed component to form an extruded object and forming the Z-directed component from the extruded object. In one embodiment, the extruded object is divided into individual Z-directed components. In one embodiment, the timing of extrusion between predetermined sections of one of the materials is varied in order to stagger the sections in the extruded object.

## Claims

### Claim 1

A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board, comprising:
simultaneously extruding a plurality of materials in the cross-sectional shape of the Z-directed component to form an extruded object with the plurality of materials arranged relative to each other in their operative positions for electrical function of the Z-directed component;
separating a segment from the extruded object; and
curing the separated segment, the cured segment forming the Z-directed component insertable into a mounting hole in a printed circuit board.

### Claim 2 (depends on 1)

The method of claim 1, wherein said extruding the plurality of materials in the cross-sectional shape of the Z-directed component includes extruding the plurality of materials in a lengthwise direction of the Z-directed component.

### Claim 3 (depends on 2)

The method of claim 2, wherein the plurality of materials extend lengthwise through substantially the entire extruded object.

### Claim 4 (depends on 1)

The method of claim 1, wherein one of the plurality of extruded materials is a conductive material that forms a conductive channel in the Z-directed component.

### Claim 5 (depends on 4)

The method of claim 4, further comprising applying a conductive trace to one of a top surface and a bottom surface of the Z-directed component that connects with the conductive channel to provide an interconnection between the conductive channel and a trace on the printed circuit board.

### Claim 6 (depends on 4)

The method of claim 4, wherein the extruded conductive material extends to a side surface of the Z-directed component to provide an interconnection between the conductive channel and a trace on the printed circuit board.

### Claim 7 (depends on 4)

The method of claim 4, further comprising applying a layer of insulator on one of a top surface and a bottom surface of the Z-directed component to protect a portion of the extruded conductive material that is exposed at the respective top or bottom surface of the Z-directed component.

### Claim 8 (depends on 4)

The method of claim 4, further comprising twisting the extruded object while extruding the plurality of materials to cause the conductive channel to spiral in the Z-directed component.

### Claim 9 (depends on 1)

The method of claim 1, further comprising compressing the Z-directed component with a plug that includes a recess formed in an end thereof having a tapered rim around a periphery of the recess to form a corresponding taper in one of a top surface and a bottom surface of the Z-directed component.