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US 2019/0084121 A1Published application
Polishing pad and polishing method
AssigneeFujimi Incorporated
InventorsMaiko ASAI, Yuuichi ITO, Kazusei TAMAI, Muneaki TAHARA
Life of this patent
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Abstract
There is provided a polishing pad that ensures sufficiently performing polishing up to a part near a projection portion and an inner surface of a recessed portion in a surface of an object to be polished in polishing the object to be polished having a surface with at least one of the projection portion and the recessed portion. The polishing pad includes a napped part (1) where a plurality of fibers (12) with a length of 3 mm or more are napped on a surface of a base portion (11). A count of the fibers (12) is 10000 pieces/cm2 or more.
Claims22
A polishing pad comprising
- a base portion, and
- a napped part in which a plurality of fibers with a length of 3 mm or more are napped on a surface of the base portion, wherein
- a count of the fibers is 10000 pieces/cm2 or more.
Dependencies are inferred from the claim text.