Component supply device and tape peeling method in component supply device
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorATUYUKI HORIE
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Abstract
There is provided a component supply device for supplying a component to a component mounter, including: a transporter that transports a carrier tape in which the component is stored and of which an upper surface is sealed with a cover tape, along a transport path; a peeler that is disposed above the transport path and peels off the cover tape from the carrier tape; and an ejector that ejects a gas for capturing the cover tape by the peeler.
Claims12
A component supply device for supplying a component to a component mounter, the component supply device comprising:
- a transporter that transports a carrier tape along a transport path, the carrier tape storing the component and having an upper surface sealed with a cover tape;
- a peeler that is disposed above the transport path and peels off the cover tape from the carrier tape;
- and
- an ejector that ejects a gas for capturing the cover tape by the peeler.
A tape peeling method for peeling off a cover tape from a carrier tape in a component supply device for supplying a component to a component mounter, the carrier tape storing the component and having an upper surface sealed with the cover tape, the method comprising:
- transporting the carrier tape along a transport path;
- peeling the cover tape from the carrier tape by a peeler disposed above the transport path;
- and
- ejecting by an ejector a gas for capturing the cover tape by the peeler.
Dependencies are inferred from the claim text.