Electronic Device and Method of Making the Same Using Surface Mount Technology

A system for manufacturing an electronic device, comprising:

• a) a printer configured to print a conductive adhesive onto pads at ends of traces on a substrate;
• b) a surface mounting machine, configured to place one or more components having a non-standard size and/or shape onto the pads with the conductive adhesive thereon;
• and
• c) a curing station, configured to cure the conductive adhesive after the component(s) have been placed onto the pads of the substrate.

An electronic device, comprising:

• a) a substrate having a plurality of traces thereon, each of said traces having a pad at one or more ends thereof;
• b) one or more components having a non-standard size and/or shape, wherein each of the one or more components is on a first subset of the pads;
• and
• c) a cured conductive adhesive between the pads and the one or more components, the cured conductive adhesive electrically connecting one of the pads to a corresponding terminal of the one or more components.

A curable conductive adhesive, comprising:

• a) an initiator that is thermally activated or activated upon irradiation with light having a wavelength within a predetermined band;
• b) one or more monomers that are polymerized by the activated initiator;
• c) one or more co-monomers that are co-polymerized with the monomers, the one or more co-monomers having a formula with at least three functional groups that are co-polymerizable with the one or more monomers by the activated initiator;
• and
• d) elastic conductive filaments or particles dispersed in the conductive adhesive, wherein the conductive adhesive is curable at a temperature of 150° C. or less.