Glue dispensing method and circuit board
AssigneeHuawei Technologies Co., Ltd.
InventorLingchao Deng
Life of this patent
Estimating the term…
Abstract
A glue dispensing method includes making a glue dispensing hole in a processing region. The processing region is a region that is in a surface mount region corresponding to the surface mount component and in which no electronic circuit and pad exist. The method also includes welding the surface mount component onto the circuit board. The method further includes injecting glue into the glue dispensing hole, to fill a gap between the surface mount component and the circuit board, and placing the circuit board still, to wait for curing of the glue.
Claims21
1-14. (canceled)
A method, comprising:
- making a glue dispensing hole in a processing region of a circuit board, wherein the processing region of the circuit board covers a part of a surface mount region of a surface mount component, wherein the part of the surface mount region is without electronic circuit or pad;
- mounting the surface mount component onto the circuit board;
- and
- after mounting, injecting glue through the glue dispensing hole into a gap between the surface mount component and the circuit board.
A circuit board assembly, comprising:
- a circuit board body;
- a surface mount component that is flatly mounted on the circuit board body;
- a glue dispensing hole disposed in a processing region on the circuit board body, wherein the processing region of the circuit board body covers a part of a surface mount region of the surface mount component, wherein the part of the surface mount region is without electronic circuit or pad;
- a gap between the surface mount component and the circuit board body, wherein the gap is disposed below the glue dispensing hole;
- and
- glue in the gap, wherein the glue is injected into the gap through the glue dispensing hole.
A circuit board, comprising:
- a circuit board body;
- a connector socket that is flatly mounted on the circuit board body,
- a glue dispensing hole disposed in a processing region on the circuit board body, wherein the processing region covers a part of a mount region of the connector socket, wherein the part of the mount region is without electronic circuit or pad;
- and
- glue in a void between the connector socket and the circuit board body, wherein the glue is injected through the glue dispensing hole into the void.
Dependencies are inferred from the claim text.