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US 2019/0059155 A1Published application
3d printed sensor and cushioning material
AssigneeIntel Corporation
InventorsTodd Sean Harple, Francis Anthony Bitonti, Peter Emery Wildfeuer
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Abstract
Methods, apparatus, systems and articles of manufacture are disclosed relating to 3D-printed structures. An example 3D-printed structure includes a first conductive substrate, a second conductive substrate and a dielectric structure between the first conductive substrate and the second conductive substrate, the dielectric structure including a latticed structure having a first stiffness in a first direction and a second stiffness in a second direction different than the first direction.
Claims19
A 3D-printed structure, comprising:
- a first conductive substrate;
- a second conductive substrate;
- and
- a dielectric structure between the first conductive substrate and the second conductive substrate, the dielectric structure including first and second latticed structures, the first and second latticed structures having a first stiffness in a first direction and a second stiffness in a second direction different than the first direction, the first latticed structure including a first plurality of legs extending inwardly at a first bend angle, the second latticed structure including a second plurality of legs extending inwardly at a second bend angle different from the first bend angle.
1 more element
19-30. (canceled)
Dependencies are inferred from the claim text.