US 2019/0059153 A1Published application

Multi-layer circuit board capable of being applied with electrical testing and method for manufacturing the same

AssigneeKinsus Interconnect Technology Corp.

InventorsChin-Kuan Liu, Chao-Lung Wang, Shuo-Hsun Chang, Yu-Te Lu, Chin-Hsi Chang

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Abstract

A multi-layer circuit board capable of being applied with electrical testing includes a patterned metal-interface layer, a metallic delivery loading plate, an electrical connection layer, a conductive corrosion-barrier layer, a bottom dielectric layer, and a multi-layer circuit structure. The multi-layer circuit structure is disposed on the delivery loading plate through the bottom dielectric layer. The top-layer circuit of the multi-layer circuit structure is electrically connected to the conductive corrosion-barrier layer through the bottom-layer circuit and the electrical connection layer. The delivery loading plate and the patterned metal-interface layer expose the conductive corrosion-barrier layer. Therefore, before the multi-layer circuit board is packaged, an electrical testing can be applied to the multi-layer circuit board to check if it can be operated normally. Hence, costs for figuring out reasons of the unqualified electronic component can be reduced, and responsibilities for the unqualified electrical testing result of the electronic component can be clarified.

Claims16

Dependent claims

A multi-layer circuit board capable of being applied with electrical testing, the multi-layer circuit board comprising:

a patterned metal interface layer being conductive;
a delivery loading plate overlapping on a top surface of the patterned metal interface layer, the delivery loading plate comprising a first side and a second side opposite to the first side, wherein the second side is connected to the top surface of the patterned metal interface layer, and the delivery loading plate is made of metal;
a bottom dielectric layer overlapping on the first side of the delivery loading plate;
a multi-layer circuit structure overlapping on the bottom dielectric layer and the multi-layer circuit structure comprising:
a bottom-layer circuit on the bottom dielectric layer;
a top dielectric layer on a top side of the bottom-layer circuit;
and
a top-layer circuit on the top dielectric layer and electrically connected to the bottom-layer circuit;
a conductive corrosion-barrier layer on the bottom dielectric layer and electrically connected to the bottom-layer circuit;
and
an electrical connection layer on the bottom dielectric layer and connected between the bottom-layer circuit and the conductive corrosion-barrier layer;
wherein the delivery loading plate and the patterned metal interface layer expose the conductive corrosion-barrier layer;
wherein the conductive corrosion-barrier layer comprises a gold layer and a nickel layer, the nickel layer is connected between the electrical connection layer and the gold layer, a width of the gold layer, a width of the nickel layer, and a width of the electrical connection layer correspond to each other.

10 more elements

Dependencies are inferred from the claim text.