Electronic device with encapsulated circuit assembly having an integrated metal layer

A wearable electronic device, comprising:

• an enclosure;
• and
• a circuit assembly positioned within the enclosure and comprising:
• a printed circuit board;
• a group of electrical components attached and electrically coupled to the printed circuit board;
• a molded structure encapsulating the group of electrical components;
• and
• a metal layer formed over the molded structure and defining:
• an electromagnetic shield for one or more electrical components of the group of electrical components;
• and
• an electrode electrically isolated from the electromagnetic shield and configured to electrically couple to an electrical component of the wearable electronic device that is distinct from the circuit assembly.

A method of forming a circuit assembly, comprising:

• forming a molded structure over a group of electrical components positioned along a printed circuit board to encapsulate the group of electrical components within the molded structure;
• and
• forming a metal layer along an outer surface of the molded structure to define:
• (1) an electrode electrically coupled to the group of electrical components, and
• (2) a shield portion electrically isolated from the electrode and configured to shield the group of electrical components from electromagnetic interference.