Multi-layered fabrication processing

An in-vivo electronic system comprising:

• at least one multi-layered electronic device comprising two or more stacked metal conducting layers, each having a trace and one or more contact pads, a dielectric layer having at least one through hole and disposed between metal conducting layers, and at least one electrical connection extending between the contact pads of metal conducting layers and through the at least one through hole of the dielectric layer;
• a satellite coupled to at least one of the at least one multi-layered electronic device;
• and
• a controller hub electrically connected to the at least one multi-layered electronic device via the satellite.

A method of manufacturing a multi-layered electronic device, the method comprising:

• forming a first metal conducting layer comprising a trace and one or more contact pads;
• depositing a dielectric layer adjacent to the first metal conducting layer;
• forming a second metal conducting layer comprising a trace and one or more contact pads and positioning the second metal conducting layer adjacent to the dielectric layer on an opposite surface from the first metal conducting layer;
• creating through holes extending through the dielectric layer;
• connecting the contact pads of the first and second metal conducting layers by providing an electrical connection extending through the dielectric layer through hole;
• and
• laminating the multi-layered electronic device in an insulating material.