Speaker Module, and Audio Compensation Method and Apparatus
AssigneeHuawei Technologies Co., Ltd.
InventorDong Tang
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AssigneeHuawei Technologies Co., Ltd.
InventorDong Tang
Estimating the term…
A speaker module, and an audio compensation method and apparatus and relates to the field of terminal technologies. The speaker module includes an audio component and a speaker board. A power contact, a ground contact, and a general-purpose input/output (GPIO) contact are disposed on the speaker board, and a connecting component is disposed between the audio component and the speaker board. A connection status of the GPIO contact is any one of the following. The connecting component is a conductor, and the GPIO contact is conducted to the power contact using the connecting component, the connecting component is a conductor, and the GPIO contact is conducted to the ground contact using the connecting component, or the connecting component is a non-conductor, and the GPIO contact is disconnected from both the power contact and the ground contact.
A speaker circuit, comprising:
An audio compensation method, applied to an audio compensation apparatus comprising a speaker circuit, comprising:
An audio compensation apparatus, comprising:
Dependencies are inferred from the claim text.