Integration of millimeter wave antennas in reduced form factor platforms

A millimeter wave antenna assembly comprising:

• a first planar substrate;
• a ground plane disposed on said first planar substrate;
• a second planar substrate disposed on said ground plane;
• an antenna radiation element disposed on said second planar substrate, said antenna radiation element to transmit a signal in the millimeter wave frequency region;
• a via to provide a conductive path for said signal from a microstrip feed line, beneath said first planar substrate, to said antenna radiation element;
• and
• a dielectric layer disposed on said antenna radiation element to provide increased antenna gain under conditions of reduced air gap between said antenna radiation element and a structural element of an enclosing platform.

A method for fabrication of a millimeter wave antenna assembly, said method comprising:

• disposing a ground plane on a first planar substrate;
• disposing a second planar substrate on said ground plane;
• disposing an antenna radiation element on said second planar substrate, said antenna radiation element to transmit a signal in the millimeter wave frequency region;
• inserting a via perpendicularly through said ground plane and said planar substrates, said via to provide a conductive path for said signal from a microstrip feed line, located beneath said first planar substrate, to said antenna radiation element;
• and
• disposing a dielectric layer on said antenna radiation element to provide increased antenna gain under conditions of reduced air gap between said antenna radiation element and a structural element of an enclosing platform.

A platform comprising:

• a processor;
• a wireless transmitter circuit coupled to said processor, said wireless transmitter circuit to receive a baseband signal for transmission and to convert said baseband signal to a millimeter wave signal;
• a microstrip feedline to couple said wireless transmitter circuit to one or more antenna assemblies;
• and
• said one or more antenna assemblies comprising:
• a first planar substrate;
• a ground plane disposed on said first planar substrate;
• a second planar substrate disposed on said ground plane;
• an antenna radiation element disposed on said second planar substrate, said antenna radiation element to transmit said millimeter wave signal;
• a via to provide a conductive path for said millimeter wave signal from said microstrip feed line, located beneath said first planar substrate, to said antenna radiation element;
• and
• a dielectric layer disposed on said antenna radiation element to provide increased antenna gain under conditions of reduced air gap between said antenna radiation element and a structural element of said platform.