Integrated fan-out package including dielectric waveguide

A semiconductor structure, comprising:

• a dielectric waveguide;
• a first pair of metal structures disposed at an input end and different sides of the dielectric waveguide, wherein the first pair of metal structures are disposed in layers different from each other;
• and
• a second pair of metal structures disposed at an output end and different sides of the dielectric waveguide, wherein the second pair of metal structures are disposed in layers different from each other,
• wherein the dielectric waveguide are coupled to one of the first pair of metal structures and one of the second pair of metal structures in regions where a width of the dielectric waveguide is tapered from a first width to a second width.

A method, comprising:

• applying a molding compound to surround a driver die and a receiver die;
• forming a first transmission electrode and a first receiver electrode that are separated from each other, within a first layer over the driver die, the receiver die, and the molding compound;
• forming a waveguide dielectric material overlying the first layer, to be patterned to form a dielectric waveguide;
• and
• forming a second transmission electrode and a second receiver electrode that are separated from each other, within a second layer that is formed over the first layer, wherein the second transmission electrode is coupled to the driver die and the dielectric waveguide, and the second receiver electrode is coupled to the receiver die and the dielectric waveguide,
• wherein the first transmission electrode and the second transmission electrode are mirror images, and the first receiver electrode and the second receiver electrode are mirror images.