Encapsulation structure for transparent flexible organic electronic device

An encapsulation structure for a transparent flexible organic electronic device, the encapsulation structure comprising:

• a flexible substrate;
• and
• at least one hybrid unit structure provided on at least one surface of the flexible substrate and comprising a stress relief film, a barrier film, and a moisture absorbing film stacked on one another,
• wherein, in the at least one hybrid unit structure, the stress relief film, the barrier film, and the moisture absorbing film individually have pinholes, and have a pinhole decoupling structure in which the pinholes of adjacent thin films among the stress relief film, the barrier film, and the moisture absorbing film are misaligned.

A method of manufacturing an encapsulation structure for a transparent flexible organic electronic device, the method comprising:

• generating, on at least one surface of a flexible substrate, at least one hybrid unit structure comprising a zinc oxide thin film, an aluminum oxide thin film, and a magnesium oxide thin film stacked on one another,
• wherein the zinc oxide thin film is generated using atomic layer deposition (ALD), chemical vapor deposition (CVD), molecular layer deposition (MLD), or physical vapor deposition (PVD),
• wherein the aluminum oxide thin film is generated using ALD, CVD, MLD, or PVD, and
• wherein the magnesium oxide thin film is generated using ALD, CVD, MLD, or PVD.