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US 2019/0058153 A1Published application
Package substrate, manufacturing method thereof, oled display panel and manufacturing method thereof
AssigneeBoe Technology Group Co., Ltd.
InventorChengyuan LUO
Life of this patent
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Abstract
A package substrate, a manufacturing method thereof, an organic light-emitting diode (OLED) display panel and a manufacturing method thereof are provided. The package substrate includes a transparent substrate; a plurality of spacers disposed on the transparent substrate; and auxiliary electrodes provided on the spacers and in a non-light-emitting region. Orthographic projections of the spacers on an array substrate fall within orthographic areas of a pixel define layer (PDL) on the array substrate.
Claims16
A package substrate, arranged oppositely to an array substrate, comprising:
- a transparent substrate;
- a plurality of spacers provided on the transparent substrate;
- and
- auxiliary electrodes provided on the spacers and in a non-light-emitting region;
- wherein orthographic projections of the plurality of spacers on the array substrate fall within orthographic areas of a pixel define layer (PDL) on the array substrate.
2 more elements
Dependencies are inferred from the claim text.