Flexible display panel fabrication method and fexible display panel

A flexible display panel, comprising:

• a flexible backing plate, wherein the flexible backing plate comprises a plurality of mutually parallel backing cavities;
• a plurality of metal patterns respectively embedded in the plurality of mutually parallel backing cavities, wherein each of the metal patterns comprises a scan and a plurality of gate electrodes connected to the scan line;
• a plurality of thin-film transistors (TFTs) arranged in an array on the flexible backing plate and each of the metal patterns;
• and
• organic light-emitting diode (OLED) light emissive elements arranged on the plurality of TFTs that are arranged in an array.

A flexible display panel fabrication method, comprising the following steps:

• Step S1:
• providing a flexible backing plate and depositing a photoresist layer on the flexible backing plate;
• Step S2:
• subjecting the photoresist layer to patterning so as to form a plurality of mutually spaced photoresist zones, wherein a through hole is formed in two adjacent ones of the photoresist zones;
• Step S3:
• subjecting the flexible backing plate to cavity formation conducted with the photoresist zones as a mask so as to form a plurality of mutually parallel backing cavities respectively at locations corresponding to the through holes;
• Step S4:
• depositing a metal film on the photoresist zones and the flexible backing plate to form a metal layer covering the photoresist zones and a plurality of metal patterns that are embedded in the plurality of mutually parallel backing cavities,
• wherein each of the metal patterns comprises a scan line and a plurality of gate electrodes connected to the scan line;
• Step S5:
• peeling off the photoresist zones to remove the photoresist zones and the metal layer located on the photoresist zones;
• and
• Step S6:
• forming a plurality of thin-film transistors (TFTs) that are arranged in an array on the flexible backing plate and each of the metal patterns embedded in the backing cavities and depositing organic light-emitting diode (OLED) light emissive elements on the plurality of TFTs that are arranged in an array;
• wherein the through holes each have opposite sidewalls each of which defines an angle that is an obtuse angle with respect to an undersurface of the photoresist zones and also defines an angle that is an acute angle with respect to an upper surface of the photoresist zones;
• wherein the through holes each have a cross section that is an isosceles trapezoid, and isosceles trapezoid has a lower base that is greater than an upper base;
• wherein the backing cavities have a depth of 300-3000 nm;
• and
• wherein the metal patterns has a thickness that corresponds to the depth of the backing cavities.