Thermoelectric micro-module with high leg density for energy harvesting and cooling applications
AssigneeThe Regents of the University of Michigan
InventorsKhalil NAJAFI, Yi YUAN, Ethem AKTAKKA
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Abstract
Micro-scale thermoelectric devices having high thermal resistance and efficiency for use in cooling and energy harvesting applications and relating fabricating methods are disclosed. The thermoelectric devices include first substrates substantially parallel with second substrates. Scaffold members are deposited between the first and second substrate. The scaffold members include a plurality of cavities having sidewalls. The scaffold members may be formed from the second substrate. The sidewalls are substantially vertical with respect to the second substrate. The sidewalls may be substantially parallel. Thermoelectric materials are deposited on the sidewalls.
Claims24
A high-aspect thermoelectric device, comprising:
- a first substrate comprised of thermally conductive material;
- a second substrate comprised of thermally conductive material and substantially parallel with the first substrate;
- a scaffold member having a first surface and a second surface sandwiched between the first substrate and the second substrate, wherein
- the first surface of the scaffold member faces the first substrate and the second surface of the scaffold member faces the second substrate,
- the first surface of the scaffold member includes a plurality of cavities, and
- each cavity defining a plurality of sidewalls formed at an angle less than fifteen degrees from vertical and extending between the first substrate and the second substrate;
- and
- a thermoelectric film comprised of thermoelectric materials and deposited on the sidewalls of the cavities using a vapor deposition technique.
A high-aspect thermoelectric device, comprising:
- a first substrate comprised of thermally conductive material;
- a second substrate comprised of thermally conductive material and substantially parallel with the first substrate, wherein the second substrate includes a plurality of pillars extending from a first surface of the second substrate towards the first substrate, each pillar defines a first sidewall and a second sidewall, the first sidewalls of the pillars face a first direction, the second sidewalls of the pillars face a second direction opposing the first direction, the first sidewall and the second sidewall of each pillar are substantially parallel, and pillars in the plurality of pillars are substantially parallel with each other;
- and
- a thermoelectric film comprised of thermoelectric materials and deposited on the sidewalls of the pillars using a vapor deposition technique.
A method of fabricating a high-aspect thermoelectric device, the method comprising:
- etching a first silicon substrate to form a plurality of pillars extending upwardly from a first surface of the first substrate, each pillar defining a first sidewall and a second sidewall, wherein the first sidewalls of the pillars face a first direction, the second sidewalls of the pillars face a second direction opposing the first direction, the first sidewall and the second sidewall of each pillar are substantially parallel, and pillars in the plurality of pillars are substantially parallel with each other;
- oxidizing the pillars;
- depositing a first thermoelectric material onto the first sidewall of each oxidized pillar from a first source;
- depositing a second thermoelectric material onto the second sidewall of each oxidized pillar from a second source;
- and
- bonding a second substrate onto the first substrate and thereby sandwiching the thermoelectric material between the first substrate and the second substrate, wherein a first surface of the second substrate faces the first surface of the first substrate.
-29. (canceled)
Dependencies are inferred from the claim text.