Light emitting element and method for fabricating the same
AssigneeLumens Co., Ltd.
InventorsSeunghyun OH, Sungsik JO, Junghyun PARK, Byeonggeon KIM
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AssigneeLumens Co., Ltd.
InventorsSeunghyun OH, Sungsik JO, Junghyun PARK, Byeonggeon KIM
Estimating the term…
A light emitting element is disclosed. The light emitting element includes: an LED chip including a light emitting semiconductor stack and first and second electrode pads disposed under the light emitting semiconductor stack and spaced apart from each other; a substrate mounted with the LED chip and including a first electrode corresponding to the first electrode pad and a second electrode corresponding to the second electrode pad; a first solder portion connecting the first electrode pad and the first electrode; and a second solder portion connecting the second electrode pad and the second electrode. The first solder portion and the second solder portion are formed without escaping from the mounting area of the LED chip on the substrate by heating a solder material to its melting point or above with an IR laser.
A light emitting element comprising:
A method for fabricating a light emitting element, comprising:
Dependencies are inferred from the claim text.