Electronic device package
AssigneesIndustrial Technology Research Institute, Intellectual Property Innovation Corporation
InventorsHsiao-Fen Wei, Kun-Lin Chuang, Yen-Ching Kuo, Kuan-Ting Chen
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Abstract
An electronic device package includes a substrate, an electronic device, and a first packaging layer. The electronic device and the first packaging layer are disposed on the substrate and the electronic device is located between the substrate and the first packaging layer. The first packaging layer includes a first oxynitride layer and a second oxynitride layer, wherein the second oxynitride layer is located between the first oxynitride layer and the electronic device. A composition of the first oxynitride layer includes SiNx1Oy1, a composition of the second oxynitride layer includes SiNx2Oy2, and x1>x2.
Claims20
An electronic device package, comprising:
- a substrate;
- an electronic device disposed on the substrate;
- and
- a first packaging layer disposed on the substrate, wherein the electronic device is located between the substrate and the first packaging layer, the first packaging layer comprises a first oxynitride layer and a second oxynitride layer, the second oxynitride layer is located between the first oxynitride layer and the electronic device, a composition of the first oxynitride layer comprises SiNx1Oy1, a composition of the second oxynitride layer comprises SiNz2Oy2, and x1>x2.
Dependencies are inferred from the claim text.