Micro light-emitting diode (led) display and assembly apparatus

A display bonder apparatus, comprising:

• a first support for holding a display backplane substrate in a first position;
• a second support for holding a carrier plate in a second position, the second position over the first position;
• a mechanism to align the display backplane substrate to the carrier plate and to move one of the display backplane substrate and the carrier plate horizontally;
• and
• a piston coupled to the second support, the piston for moving the carrier plate from the second position toward the first position, and the piston for applying a force to the carrier plate to bond light-emitting diode (LED) pixel elements from the carrier plate to metal bumps on the display backplane substrate, wherein the plurality of metal bumps on the display backplane substrate has a pitch that is an integer multiple of a pitch of the plurality of LED pixel elements on the carrier plate, and wherein the integer multiple is greater than 1.

A method of manufacturing a micro-light emitting diode (LED) display panel, the method comprising:

• positioning a silicon substrate above a display backplane substrate, the silicon substrate having a plurality of light-emitting diode (LED) pixel elements thereon, and the display backplane substrate having a plurality of metal bumps thereon, wherein the plurality of metal bumps on the display backplane substrate has a pitch that is an integer multiple of a pitch of the plurality of LED pixel elements on the silicon substrate, and wherein the integer multiple is greater than 1;
• aligning the silicon substrate to the display backplane substrate;
• moving the display backplane substrate toward the silicon substrate to couple at least a portion of the plurality of LED pixel elements to corresponding ones of the plurality of metal bumps;
• applying pressure to the display backplane substrate to transfer and bond the portion of the plurality of LED pixel elements to the corresponding ones of the plurality of metal bumps;
• and, subsequently,
• separating the silicon substrate from the display backplane substrate.

A display bonder apparatus, comprising:

• a first support for holding a display backplane substrate in a first position;
• a second support for holding a silicon wafer in a second position, the second position over the first position;
• a mechanism to align the display backplane substrate to the silicon wafer and to move one of the display backplane substrate and the silicon wafer horizontally;
• and
• a piston coupled to the first support, the piston for moving the display backplane substrate from the first position toward the second position, and the piston for applying a force to the display backplane substrate to bond light-emitting diode (LED) pixel elements from the silicon wafer to metal bumps on the display backplane substrate, wherein the plurality of metal bumps on the display backplane substrate has a pitch that is an integer multiple of a pitch of the plurality of LED pixel elements on the silicon substrate, and wherein the integer multiple is greater than 1.