Integrated Circuit System With Memory Support And Method Of Manufacture Thereof

A method of manufacturing an integrated circuit system, the method comprising:

• providing a planar surface on an insulator substrate;
• forming first and second bottom electrodes over the insulator substrate;
• depositing an insulating layer over the first and second bottom electrodes;
• removing the insulating layer from regions positioned above the first and second bottom electrodes so as to expose the first and second bottom electrodes;
• depositing a first electrolyte over the first and second bottom electrodes;
• depositing a first top electrode above the first electrolyte;
• removing the first electrolyte and the first top electrode from above the second bottom electrode and from a portion of the insulating layer;
• depositing a second electrolyte over a remaining portion of the first top electrode and the second bottom electrode;
• depositing a second top electrode over the second electrolyte;
• removing the first second electrolyte and the second top electrode from above the first top electrode;
• and
• patterning and etching the second electrolyte and the second top electrode above the first bottom electrode.

An electronic design automation (EDA) tool adapted to generate data associated with a layout and a mask set of an integrated circuit system, the EDA tool defining the data in accordance with a method comprising:

• providing a planar surface on an insulator substrate;
• forming first and second bottom electrodes over the insulator substrate;
• depositing an insulating layer over the first and second bottom electrodes;
• removing the insulating layer from regions positioned above the first and second bottom electrodes so as to expose the first and second bottom electrodes;
• depositing a first electrolyte over the first and second bottom electrodes;
• depositing a first top electrode above the first electrolyte;
• removing the first electrolyte and the first top electrode from above the second bottom electrode and from a portion of the insulating layer;
• depositing a second electrolyte over a remaining portion of the first top electrode and the second bottom electrode;
• depositing a second top electrode over the second electrolyte;
• removing the first second electrolyte and the second top electrode from above the first top electrode;
• patterning and etching the second electrolyte and the second top electrode above the first bottom electrode.