Superconducting device with thermally conductive heat sink

A monolithic microwave integrated circuit (MMIC) comprising:

• a dielectric structure overlying a substrate;
• a plurality of superconducting structures residing in a first dielectric layer of the dielectric structure;
• a plurality of resistors residing in a second dielectric layer of the dielectric structure;
• a plurality of superconducting contacts residing in an intermediate layer of the dielectric structure, the intermediate layer residing between the first dielectric layer and the second dielectric layer, a first superconducting contact of the plurality of superconducting contacts coupling a first end of a given resistor to a first superconducting structure, and a second superconducting contact of the plurality of superconducting contacts coupling a second end of the given resistor to a second superconducting structure for each of the plurality of resistors;
• and
• a thermally conductive heat sink structure coupled to second ends of each of the plurality of resistors to form a common ground and to move electrons from the plurality of resistors prior to the electrons being converted to phonons;
• wherein the thermally conductive heat sink structure is formed of a normal metal that is not superconducting.