Semiconductor device
AssigneeToshiba Memory Corporation
InventorsTakashi TERADA, Ryuma YAMAMOTO
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AssigneeToshiba Memory Corporation
InventorsTakashi TERADA, Ryuma YAMAMOTO
Estimating the term…
A semiconductor device includes a semiconductor substrate, a stacked body, a transistor, first and second silicon oxides, and a first silicon nitride film. The semiconductor substrate includes a cell region. The stacked body is provided in the cell region and included in a memory cell array. The transistor is disposed on the semiconductor substrate between the stacked body and an edge portion of the semiconductor substrate. The first silicon oxide film surrounds the stacked body and is disposed between the stacked body and the transistor. The second silicon oxide film surrounds the first silicon oxide film, is separated from the first silicon oxide film, and is disposed between the edge portion and the first silicon oxide film. The first silicon nitride film includes a portion provided on the substrate in a first region. The portion surrounds the stacked body.
A semiconductor device, comprising:
Dependencies are inferred from the claim text.