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US 2019/0057955 A1Published application
Video wall module and method of producing a video wall module
AssigneeOSRAM Opto Semiconductors GmbH
InventorJürgen Moosburger
Life of this patent
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Abstract
A video wall module includes a plurality of light emitting diode chips, each including first contact electrodes and second contact electrodes arranged at a contact side, wherein the light emitting diode chips are arranged at a top side of a multilayer circuit board, and the contact electrodes electrically conductively connect to a first metallization layer arranged at the top side of the circuit board.
Claims21
-19. (canceled)
A video wall module comprising a plurality of light emitting diode chips,
- each comprising first contact electrodes and second contact electrodes arranged at a contact side,
- wherein the light emitting diode chips are arranged at a top side of a multilayer circuit board, and
- the contact electrodes electrically conductively connect to a first metallization layer arranged at the top side of the circuit board.
A method of producing a video wall module comprising:
- providing a multilayer circuit board comprising a first metallization layer arranged at a top side of the circuit board;
- providing a plurality of light emitting diode chips, wherein each light emitting diode chip comprises a contact side comprising a first contact electrode arranged at the contact side and a second contact electrode arranged at the contact side;
- and
- arranging the light emitting diode chips at the top side of the circuit board, wherein the contact electrodes electrically conductively connect to the first metallization layer.
1 more element
A video wall module comprising a plurality of light emitting diode chips,
- each comprising first contact electrodes and second contact electrodes arranged at a contact side,
- wherein the light emitting diode chips are arranged at a top side of a multilayer circuit board, and
- at the contact side of each light emitting diode chip there is arranged a patterned section of a conductive die attach film that electrically conductively connects the contact electrodes of the light emitting diode chip to a first metallization layer arranged at the top side of the circuit board.
Dependencies are inferred from the claim text.