US 2019/0057948 A1 · CHIP PACKAGE STRUCTURE

Abstract

A chip package structure includes a chip package layer and at least one conductive structure layer. The chip package layer includes at least one chip and an encapsulant. The chip has an upper surface, and the encapsulant is used to encapsulate the chip and expose the upper surface. The conductive structure layer includes a plurality of first conductive pillars and a plurality of second conductive pillars. The first conductive pillars are disposed on the upper surface, the second conductive pillars are disposed on the upper surface and located between an edge of the upper surface and the first conductive pillars. A density of the second conductive pillars along an extending direction of the edge is greater than or equal to 1.2 times of a density of the first conductive pillars along the extending direction of the edge.

Claims18

Dependent claims

A chip package structure, comprising:

a chip package layer, comprising at least one chip and an encapsulant, wherein the at least one chip has an upper surface, and the encapsulant encapsulates the at least one chip and exposes the upper surface;
and
at least one conductive structure layer, comprising a plurality of first conductive pillars and a plurality of second conductive pillars, wherein the first conductive pillars are disposed on the upper surface, the second conductive pillars are disposed on the upper surface, the second conductive pillars are located between an edge of the upper surface and the first conductive pillars, and a density of the second conductive pillars along an extending direction of the edge is greater than or equal to 1.2 times of a density of the first conductive pillars along the extending direction of the edge.

Dependencies are inferred from the claim text.

Chip package structure

Life of this patent

Chip package structure

Life of this patent

Abstract

Claims18