Molded semiconductor package and related methods
AssigneeSemiconductor Components Industries, LLC
InventorsSw WANG, CH CHEW, Eiji KUROSE, How Kiat LIEW
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Abstract
Implementations of semiconductor packages may include: a semiconductor die having a first side and a second side; one or more bumps included on the first side of the wafer, the bumps comprising a first layer having a first metal and a second layer including a second metal. The first layer may have a first thickness and the second layer may have a second thickness. The semiconductor package may also have a mold compound encapsulating all the semiconductor die except for a face of the one or more bumps.
Claims20
A semiconductor package comprising:
- a semiconductor die comprising a first side and a second side;
- one or more bumps comprised on the first side of the wafer, the bumps comprising a first layer comprising a first metal and a second layer comprising a second metal, wherein the first layer comprises a thickness of 10 microns and the second layer comprises a thickness of 20 microns;
- and
- a mold compound encapsulating all the semiconductor die except for a face of the one or more bumps.
A method for forming semiconductor packages, the method comprising:
- providing a wafer, the wafer comprising a first side and a second side;
- forming a plurality of bumps on the first side of the wafer, the bumps comprising a first layer and a second layer;
- forming one or more grooves between the bumps on the first side of the wafer, the one or more grooves having a predetermined depth into the wafer;
- overmolding the plurality of bumps with a mold compound;
- grinding the mold compound to expose a face of the plurality of bumps;
- grinding the second side of the wafer to singulate a plurality of die comprised in the wafer;
- overmolding the second side of the wafer;
- and
- singulating the mold compound between the plurality of die to form a plurality of semiconductor packages, the plurality of die fully encapsulated within the mold compound except for the face of the plurality of bumps.
A method for forming semiconductor packages, the method comprising:
- providing a wafer, the wafer comprising a first side and a second side;
- forming a first set of bumps on the first side of the wafer, the first set of bumps comprising a first metal;
- forming a second set of bumps on the first set of bumps, the second set of bumps comprising a second metal different from the first metal;
- sawing one or more grooves between the first set of bumps and the second set of bumps on the first side of the wafer;
- overmolding the first side of the wafer with a mold compound to encapsulate the first set of bumps and the second set of bumps;
- grinding the mold compound to expose a face of the second set of bumps;
- grinding the second side of the wafer to singulate a plurality of die comprised in the wafer;
- overmolding the second side of the wafer;
- and
- singulating the mold compound between the plurality of die to form a plurality of semiconductor packages, the plurality of die being fully encapsulated within the mold compound except for the face of the second set of bumps.
Dependencies are inferred from the claim text.