Stairstep interposers with integrated shielding for electronics packages

An electronics package, comprising:

• a first die;
• a second die;
• an interposer including an insulating material having a stairstep structure with a first step surface, a second step surface, and a bottom surface, wherein a first conductive signal pathway extends from the first step surface to the bottom surface, a second conductive signal pathway extends from the second step surface to the bottom surface, the first die is coupled to the first conductive signal pathway at the first step surface, and the second die is coupled to the second conductive signal pathway at the second step surface;
• and
• a package substrate coupled to the bottom surface of the interposer;
• wherein the interposer includes a conductive shield disposed within the insulating material to shield the first and second conductive signal pathways.

A method of manufacturing an interposer, comprising:

• forming a multilayer assembly on a base material, each layer comprising a dielectric region and a corresponding sacrificial region, wherein the dielectric regions form an insulating material having a stairstep structure, at least one conductive signal pathway extends from a step surface of the insulating material to a bottom surface of the insulating material, and the multilayer assembly includes a conductive shield disposed within the insulating material to shield the conductive signal pathway;
• removing the sacrificial regions;
• and
• removing the base material.

A computing device, comprising:

• a circuit board;
• and
• an electronics package, coupled to the circuit board, including:
• a first die,
• a second die,
• an interposer including an insulating material having a stairstep structure with a first step surface, a second step surface, and a bottom surface, wherein a first conductive signal pathway extends from the first step surface to the bottom surface, a second conductive signal pathway extends from the second step surface to the bottom surface, the first die is coupled to the first conductive signal pathway at the first step surface, and the second die is coupled to the second conductive signal pathway at the second step surface, and
• a package substrate coupled to the bottom surface of the interposer,
• wherein the interposer includes a conductive shield disposed within the insulating material to shield the first and second conductive signal pathways, and wherein the first die or the second die includes a processing device.