Chip structure including heating element

A chip structure, comprising:

• a lower semiconductor substrate having a first side and a second side opposing each other;
• a first portion on the first side of the lower semiconductor substrate, and having a gate wiring;
• and
• a second portion on the second side of the lower semiconductor substrate, and having a second side wiring and a heating element,
• wherein the heating element is on a same plane as that of the second side wiring and has a length greater than that of the second side wiring.

A chip structure, comprising:

• a lower chip structure having a wiring and a heating element, the heating element being on a same plane as that of the wiring and having a length greater than that of the wiring;
• and
• an upper chip structure disposed on the lower chip structure and having a pixel array region,
• wherein the heating element overlaps a portion of the pixel array region, and
• wherein an arrangement density of the wiring and an arrangement density of the heating element are configured to reduce temperature differences between different areas of the pixel array region.