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US 2019/0057915 A1Published application
Hybrid microelectronic substrates
AssigneeIntel Corporation
InventorsRobert Starkston, Robert L. Sankman, Scott M. Mokler, Richard Christopher Stamey, Amruthavalli Pallavi Alur
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Abstract
Hybrid microelectronic substrates, and related devices and methods, are disclosed herein. In some embodiments, a hybrid microelectronic substrate may include a low-density microelectronic substrate having a recess at a first surface, and a high-density microelectronic substrate disposed in the recess and coupled to a bottom of the recess via solder.
Claims25
A hybrid microelectronic substrate, comprising:
- a low-density microelectronic substrate (LDMS) having a recess at a first surface;
- and
- a high-density microelectronic substrate (HDMS) disposed in the recess and coupled to a bottom surface of the recess via solder interconnects.
A computing device, comprising:
- a hybrid microelectronic substrate including:
- a first microelectronic substrate having a recess at a first surface, and
- a second microelectronic substrate disposed in the recess, wherein the second microelectronic substrate has a first surface and an opposing second surface, and wherein the second surface of the second microelectronic substrate is coupled to a bottom surface of the recess via solder interconnects;
- and
- a microelectronic device coupled to the first surface of the second microelectronic substrate.
2 more elements
A method of manufacturing a microelectronic assembly including a hybrid microelectronic substrate, comprising:
- providing a low-density microelectronic substrate (LDMS) having a first surface and an opposing second surface, wherein a first conductive pathway extends between the second surface and a location between the first and second surfaces;
- forming a recess in the first surface, wherein the recess extends down to the location;
- providing a high-density microelectronic substrate (HDMS) in the recess;
- and
- coupling the HDMS to a bottom surface of the recess via solder interconnects.
2 more elements
Dependencies are inferred from the claim text.