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US 2019/0057901 A1Published application
Method and apparatus for processing semiconductor device structures
AssigneeMicron Technology, Inc.
InventorAndrew M. Bayless
Life of this patent
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Abstract
A method of processing a device wafer comprising applying a sacrificial material to a surface of a carrier wafer, adhering a surface of the device wafer to an opposing surface of the carrier wafer, planarizing an exposed surface of the sacrificial material by removing only a portion of a thickness thereof, and planarizing an opposing surface of the device wafer. A wafer assembly is also disclosed.
Claims18
A method of processing a device wafer, the method comprising:
- applying a sacrificial material to a surface of a carrier wafer;
- adhering a surface of the device wafer to an opposing surface of the carrier wafer;
- planarizing an exposed surface of the sacrificial material by removing only a portion of a thickness thereof;
- and
- planarizing an opposing surface of the device wafer.
2 more elements
A method of processing a device wafer, comprising:
- planarizing an exposed surface of a carrier wafer bonded to a device wafer without removing material from the carrier wafer;
- and
- reducing a thickness of the device wafer from an exposed surface thereof and planarizing an exposed surface of the device wafer after the thickness has been reduced.
18-24. (canceled)
Dependencies are inferred from the claim text.