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US 2019/0057883 A1Published application
Wafer cleaning apparatus and cleaning method using the same
AssigneeSK Siltron Co., Ltd.
InventorJae Hwan YI
Life of this patent
Estimating the term…
Abstract
The present invention provides a wafer cleaning apparatus including: a cleaning tank; and a cleaning unit installed to be capable of moving upward or downward into the cleaning tank, and configured to inject a cleaning solution onto an inner wall of the cleaning tank.
Claims20
A wafer cleaning apparatus, comprising:
- a cleaning tank;
- and
- a cleaning unit installed to be capable of moving upward or downward into the cleaning tank, and configured to inject a cleaning solution onto an inner wall of the cleaning tank.
A wafer cleaning apparatus, comprising:
- a cleaning tank;
- a cleaning unit installed to be capable of moving upward or downward into the cleaning tank, and configured to inject a cleaning solution onto an inner wall of the cleaning tank;
- and
- a control unit configured to descend the cleaning unit to control the cleaning solution to be injected when the cleaning solution inside the cleaning tank is being discharged or completely discharged.
1 more element
A cleaning method of a wafer cleaning apparatus, comprising:
- discharging a cleaning solution accommodated inside a cleaning tank;
- descending a cleaning unit;
- injecting a cleaning solution onto an inner wall of the cleaning tank;
- and
- elevating the cleaning unit positioned at a lower portion of the inner wall of the cleaning tank to an upper portion of the cleaning tank.
2 more elements
Dependencies are inferred from the claim text.