High pressure and high temperature anneal chamber
AssigneeApplied Materials, Inc.
InventorsJean DELMAS, Steven VERHAVERBEKE, Kurtis LESCHKIES
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AssigneeApplied Materials, Inc.
InventorsJean DELMAS, Steven VERHAVERBEKE, Kurtis LESCHKIES
Estimating the term…
Embodiments of the disclosure relate to an apparatus and method for annealing semiconductor substrates. In one embodiment, a batch processing chamber is disclosed. The batch processing chamber includes a chamber body enclosing a processing region, a gas panel configured to provide a processing fluid into the processing region, a condenser fluidly connected to the processing region and a temperature-controlled fluid circuit configured to maintain the processing fluid at a temperature above a condensation point of the processing fluid. The processing region is configured to retain a plurality of substrates during processing. The condenser is configured to condense the processing fluid into a liquid phase.
A batch processing chamber for annealing substrates under high pressure at high temperature comprising:
A method of annealing substrates in a processing chamber, the method comprising:
Dependencies are inferred from the claim text.