Multilayer substrate and method of producing multilayer substrate
AssigneeMurata Manufacturing Co., Ltd.
InventorKuniaki YOSUI
Life of this patent
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Abstract
A multilayer substrate includes a laminated body including thermoplastic resin layers, a conductor pattern, a level-difference eliminating through hole, and a thickness adjustment member. The conductor pattern is on a main surface of one of the resin layers and is in the laminated body. The level-difference eliminating through hole is located at a position different from the conductor pattern in a planar view of the laminated body and penetrates the resin layer in a thickness direction. The thickness adjustment member is made of the same material as the resin layers, is located in the through hole, and has a thickness greater than a thickness of the resin layer.
Claims20
A multilayer substrate comprising:
- a laminated body including a plurality of resin layers made of a thermoplastic resin;
- a first internal conductor pattern located on a main surface of a first resin layer of the plurality of resin layers, and located in the laminated body;
- a level-difference eliminating through hole that is located at a position different from the first internal conductor pattern in a planar view of the laminated body and penetrates the first resin layer in a thickness direction;
- and
- a thickness adjustment member that is made of a same material as the plurality of resin layers, is located in the through hole, and has a thickness greater than a thickness of the first resin layer.
A method of producing a multilayer substrate comprising:
- forming an internal conductor pattern on a main surface of a first resin layer made of a thermoplastic resin;
- forming a level-difference eliminating through hole that penetrates the first resin layer in a thickness direction at a location different from the internal conductor pattern in the first resin layer;
- laminating a plurality of resin layers made of a thermoplastic resin including the first resin layer so as to position the internal conductor pattern in the laminated body and filling a resin slurry in the level-difference eliminating through hole to form the laminated body;
- and
- heat-pressing the laminated body.
Dependencies are inferred from the claim text.