Method for manufacturing mems devices and nano devices with varying degrees of hydrophobicity and hydrophilicity in a composite photoimageable dry film

A method for making a three-dimensional (“3D”) structure from a composite photoresist film comprising the steps of:

• (A) applying a first layer of photoresist material to a carrier film, the first layer being devoid of a hydrophobicity agent;
• (B) drying the first layer to provide a dried first layer;
• (C) applying a second layer of photoresist material to the dried first layer, the second layer comprising a hydrophobicity agent;
• (D) drying the second layer to provide a composite photoresist material devoid of intermediate adhesion layer(s);
• (E) applying an adhesion layer to a substrate surface;
• (F) laminating the composite photoresist material to the adhesion layer;
• (G) exposing the composite photoresist material to a radiation exposure wavelength selected from the group consisting of e-line, g-line, h-line, i-line, mid ultraviolet (UV), and deep UV radiation;
• and
• (H) simultaneously developing the composite photoresist material to provide the 3D structure.

A fluid ejection device having a fluid ejection head comprising:

• a semiconductor substrate containing a plurality fluid ejection actuators on a device surface thereof and one or more fluid supply vias etched therethrough;
• an adhesion promotion layer applied to the device surface of the semiconductor substrate;
• a composite photoresist material applied to the adhesion promotion layer wherein the composite photoresist material comprises (a) a first photoresist layer devoid of a hydrophobicity agent and (b) at least a second photoresist layer comprising a hydrophobicity agent, and wherein the composite photoresist material is devoid of an adhesion promotion layer between layers of the composite photoresist material;
• and
• a controller for activating the fluid ejection head.