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US 2019/0056558 A1Published application
Multiple laser system packaging
AssigneeRockley Photonics Limited
InventorsAndrew George Rickman, Hooman Abediasl
Life of this patent
Estimating the term…
Abstract
A photonic chip comprising tunable lasers, emitters and other optical components such as waveguides, wavelength band combiners and wavelength lockers, is packaged with one or more complementary metal-oxide semiconductor chips in different ways. The complementary metal-oxide semiconductor chips are arranged on the sides or the bottom of the photonic chip. Through-Si-vias or wire bonding provides electrical contact between the photonic chip and the complementary metal-oxide semiconductor chips.
Claims18
A structure comprising:
- a photonic chip comprising a plurality of lasers on at least two of four lateral regions of a top surface of the photonic chip, a plurality of emitters in a central region of the top surface, and a plurality of waveguides on the top surface, the plurality of waveguides connecting the plurality of lasers to the plurality of emitters;
- at least two complementary metal-oxide semiconductor (CMOS) chips, each CMOS chip arranged on a different side of the photonic chip;
- and
- wire bonds connecting the at least two CMOS chips to the photonic chip.
1 more element
A structure comprising:
- a photonic silicon (Si) chip comprising a plurality of lasers on at least two of four lateral regions of a top surface of the photonic Si chip, a plurality of emitters in a central region of the top surface, and a plurality of waveguides on the top surface, the plurality of waveguides connecting the plurality of lasers to the plurality of emitters;
- a complementary metal-oxide semiconductor (CMOS) chip on a bottom surface of the photonic Si chip;
- and
- through-Si-vias connecting the CMOS chip to the photonic Si chip.
1 more element
A method comprising:
- providing a photonic chip;
- fabricating a plurality of lasers on at least two of four lateral regions of a top surface of the photonic chip, a plurality of emitters in a central region of the top surface, and a plurality of waveguides on the top surface, the plurality of waveguides connecting the plurality of lasers to the plurality of emitters;
- providing at least two complementary metal-oxide semiconductor (CMOS) chips;
- arranging each CMOS chip on a different side of the photonic chip;
- and
- connecting by wire bonds the at least two CMOS chips to the photonic chip.
3 more elements
A method comprising:
- providing a photonic Si chip;
- fabricating a plurality of lasers on at least two of four lateral regions of a top surface of the photonic Si chip, a plurality of emitters in a central region of the top surface, and a plurality of waveguides on the top surface, the plurality of waveguides connecting the plurality of lasers to the plurality of emitters;
- fabricating through-Si-vias in the photonic Si chip;
- providing a complementary metal-oxide semiconductor (CMOS) chip;
- bonding the CMOS chip on a bottom surface of the photonic Si chip;
- and
- connecting the photonic Si chip to the CMOS chip through an electrical conductor in the through-Si-vias.
4 more elements
Dependencies are inferred from the claim text.