Cooling device and method for producing the cooling device
AssigneeMahle International GmbH
InventorsMatthias Tuerpe, Bernd Gruenenwald, Oliver Mamber
Life of this patent
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Abstract
A cooling device for cooling power electronics may include a heat-dissipating cooling plate and a contacting surface arranged thereon. The contacting surface may include multiple conductors arranged thereon configured to fix and contact a power electronics. The contacting surface may be electrically insulated from the heat-dissipating cooling plate. Between the heat-dissipating cooling plate and the contacting surface at least one organic intermediate layer may be arranged. The at least one organic intermediate layer may be fixed to the heat-dissipating cooling plate in a firmly bonded manner.
Claims20
A cooling device for cooling power electronics, comprising:
- a heat-dissipating cooling plate;
- a contacting surface including multiple conductors arranged thereon configured to fix and contact a power electronics, the contacting surface arranged on the heat-dissipating cooling plate;
- the contacting surface electrically insulated from the heat-dissipating cooling plate;
- wherein between the heat-dissipating cooling plate and the contacting surface at least one organic intermediate layer is arranged, the at least one organic intermediate layer fixed to the heat-dissipating cooling plate in a firmly bonded manner.
A method for producing a cooling device comprising:
- applying at least one organic intermediate layer to a heat-dissipating cooling plate;
- and
- subsequently coupling a contacting surface including multiple conductors configured to fix and contact a power electronics to the heat-dissipating cooling plate such that i) the at least one organic intermediate layer is arranged between the heat-dissipating cooling plate and the contacting surface and ii) the contacting surface is electrically insulated from the heat-dissipating cooling plate.
Dependencies are inferred from the claim text.